Elnouino, H., Bendaou, O. and Bendaou, O. 2024. Reliability-based Design Optimization (RBDO) Study Applied to the Thermal Management of a Multi-Led Chip Package. Journal of Engineering and Technological Sciences. 56, 4 (Aug. 2024), 521–534. DOI:https://doi.org/10.5614/j.eng.technol.sci.2024.56.4.8.