Elnouino, H., Bendaou, O., & Bendaou, O. (2024). Reliability-based Design Optimization (RBDO) Study Applied to the Thermal Management of a Multi-Led Chip Package. Journal of Engineering and Technological Sciences, 56(4), 521–534. https://doi.org/10.5614/j.eng.technol.sci.2024.56.4.8