ELNOUINO, H.; BENDAOU, O.; BENDAOU, O. Reliability-based Design Optimization (RBDO) Study Applied to the Thermal Management of a Multi-Led Chip Package. Journal of Engineering and Technological Sciences, [S. l.], v. 56, n. 4, p. 521–534, 2024. DOI: 10.5614/j.eng.technol.sci.2024.56.4.8. Disponível em: https://jets.itb.ac.id/jets/article/view/337. Acesso em: 9 oct. 2025.